FA Equipment
- Smartphone Assembly-Test-Packing InLine System
- Bio-Chip Inline System
- PCB Contact automatic stepper
- PCB 1st Layup System
- PCB 2nd Layup System
- High Frequency Bonding System
- Disassembly automation System
- MLCC Cutting Machine
- MLCC Dipping Machine
- MLCC foaming tape attaching device
- Automatic vacuum pressurized packager