FA Equipment

High Frequency Bonding System

High Frequency Bonding System

Device that automatically combines and lay-ups various jigs such as PPG, CCL, etc.
before inserting into hot press for loading in the PCB manufacturing loading process

SeenBnTek
Address323-10, Sandong-ri, Eumbong-myeon, Asan-si, Chungcheongnam-do
Tel T. 041-580-6600   F. 041-580-6610    Emailseenbntek@seenbntek.com

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